JIMA Copper 86-21-35322273
28um HTE Copper Foil 9um Copper Foil For Samsung Phone PCB

28um HTE Copper Foil 9um Copper Foil For Samsung Phone PCB

  • High Light

    PCB HTE roll of copper foil

    ,

    28um copper thin sheet

    ,

    9um HTE Copper Foil

  • Purity
    99.95%
  • Anti Oxidation
    180 Degree 60 Minutes, 180 Days 23 Degree
  • Color
    Red
  • Tensile Strength
    ≥ 160 MPa
  • Peel Strength
    ≥ 1 N/mm
  • Foil Profile
    RA≤0.15μm,Rz≤1.7μm
  • Application
    Samsung Phone PCB
  • Place of Origin
    china
  • Brand Name
    JIMA
  • Certification
    SGS, ISO,Reach, RoHS
  • Model Number
    EDCU-LP
  • Minimum Order Quantity
    100kg
  • Price
    negotiation
  • Packaging Details
    wooden carton
  • Delivery Time
    5-15 days
  • Payment Terms
    T/T, L/C
  • Supply Ability
    1000 Ton per month

28um HTE Copper Foil 9um Copper Foil For Samsung Phone PCB

HTE Copper Foil 9um Copper Foil 28um Used For Samsung Phone PCB​

 

Products Detail:

 

a. single side side treatment low profile foil in back/red.

b. Nominal Thickness: 9um,28um

c. Width: 5-1380mm,standard width:1290mm.

d. ID: 76 mm,152 mm.

e. Cu purity :99.8%.

f. Quality standard:IPC 4562.

 

Products use Application:

1. Polyimide board

2. Epoxy board

3. PCB and antenna PCB,FPC,Samsung Phone PCB​

 

Description.

.Excellent adhesion to etching resist..

.Anti foil cracking by high elongation at elevated temperature.

.Eco-friendly products and processes.

 

HTE Copper Foil Technical Parameters Sheet

Thickness um 9 12 18 25 35 70

IPC 4562

4.6.3.1

 

Area weight g/m² 80±1 107±3 153± 215±5 285±5 585±8

IPC 4562

4.6.3.2

Roughness (RA) μm 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4

IPC 4562

4.6.9

(RZ) μm <6.0 <6.5 <8.0 <9.0 ≤10.0 <15

 

Copper≧

% 99.8

IPC 4562

4.6.3.1

 

Tensile Strength state normal Mpa >300 >300 >300 >300 >300 >280

IPC 4562

4.6.4

state temper (180℃) Mpa >15.0 >18.0 >18.0 >18.0 >18.0 >18.0
ElongationI state normal % >3.0 >3.0 >5.0 >6.0 >10.0 >10.0

IPC 4562

3.5.3

state temper (180℃) % >2.0 >2.5 >2.5 >3.0 >5.0 >5.0
Peel strength N/mm >1.0 >1.05 >1.35 >1.70 >1.8 >2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

No color change Standard
Solderability Good Standard
Solderability Good

IPC 4562

4.6.12

Standard Width,1295(±1)mm,May according to the customer request tailor.

 

 

Package& Equipment 

28um HTE Copper Foil 9um Copper Foil For Samsung Phone PCB 0

 

FAQ:

 

Q1. Is it possible be zinc free copper foil?

Yes ,we can do it.

 

Q2. Can you provide COA?

Yes , we can.

 

Q3. Is it the Fumigation carton box?

Yes ,it is .