Name: Zinc Free 3 / 4 OZ HTE Copper Foil For CCL 500 - 5000 Meter Length Per Roll
Brand: JIMA Copper
SKU: EDCU-HC
Price: 16.00 USD
Availability: InStock

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Zinc Free 3 / 4 OZ HTE Copper Foil For CCL 500 - 5000 Meter Length Per Roll

Product Details:

Place of Origin:	china
Brand Name:	JIMA
Certification:	SGS, ISO,Reach, RoHS
Model Number:	EDCU-HC

Payment & Shipping Terms:

Minimum Order Quantity:	100kg
Price:	negotiation
Packaging Details:	wooden carton
Delivery Time:	5-15 days
Payment Terms:	T/T, L/C
Supply Ability:	1000 Ton per month

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Detailed Product Description

Anti Oxidation:	180 Degree 60 Minutes, 180 Days 23 Degree	Elongation:	≥ 1.5%
Tensile Strength:	≥ 160 MPa	Peel Strength:	≥ 1 N/mm
Foil Profile:	RA≤0.15μm，Rz≤1.7μm	Length Per Roll:	500 - 5000 Meter
Highlight:	electrodeposited copper foil , copper thin sheet

FR-4 zinc-free 3/4 OZ red HTE electrodeposited copper foil for CCL

Feature:

- Being used in the production of the different double-face and multi-player printed circuit boards.

- Perfect physical characteristic of the fine and uniform crystal structure.

- Low profile, the high intensity,high peel strength.

Specification as follow:

. Thickness: 3/4 OZ, 25 mic.

. Quality standard:IPC 4562.

. Small coil.

. Jumbo coil.

Classify:

(HD-E)-high ductility electrodeposited copper foil.

(HTE-E)-high temperature elongation electrodeposited copper foil.

(LP-E)-low profile electrodeposited copper foil.

Application:

1. Epoxy board.

2. PCB ,antenna PCB,PCB industry

So what the differences between rolled copper foil and ED copper foil

rolled copper foil higher density, the surface is relatively smooth, conducive to the production of printed circuit board after the rapid transmission of the signal, so high-frequency high-speed transmission, fine lines printed circuit board also used some calendering copper Foil.

HTE copper foil with high elongation copper foil at high temperature

Thickness		um	9	12	18	25	35	70	IPC 4562 4.6.3.1
Area weight		g/m²	80±1	107±3	153±	215±5	285±5	585±8	IPC 4562 4.6.3.2
Roughness	(RA)	μm	0.2-0.4	0.2-0.4	0.2-0.4	0.2-0.4	0.2-0.4	0.2-0.4	IPC 4562 4.6.9
Roughness	(RZ)	μm	<6.0	<6.5	<8.0	<9.0	≤10.0	<15	IPC 4562 4.6.9
Copper≧		%	99.8						IPC 4562 4.6.3.1
Tensile Strength	state normal	Mpa	>300	>300	>300	>300	>300	>280	IPC 4562 4.6.4
Tensile Strength	state temper (180℃)	Mpa	>15.0	>18.0	>18.0	>18.0	>18.0	>18.0	IPC 4562 4.6.4
ElongationI	state normal	%	>3.0	>3.0	>5.0	>6.0	>10.0	>10.0	IPC 4562 3.5.3
ElongationI	state temper (180℃)	%	>2.0	>2.5	>2.5	>3.0	>5.0	>5.0	IPC 4562 3.5.3
Peel strength		N/mm	>1.0	>1.05	>1.35	>1.70	>1.8	>2.0	IPC 4562 4.6.7
High temperature oxidation resistance(200℃, 40min)		No color change							Standard
Solderability		Good							Standard
Solderability		Good							IPC 4562 4.6.12