Name: 1290mm Width HTE CU Electrodeposited Copper Foil 70 / 35um Thickness For PCB Laminate
Brand: JIMA Copper
SKU: EDCU-HC
Price: 16.00 USD
Availability: InStock

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1290mm Width HTE CU Electrodeposited Copper Foil 70 / 35um Thickness For PCB Laminate

Product Details:

Place of Origin:	China
Brand Name:	JIMA
Certification:	SGS, ISO,Reach, RoHS
Model Number:	EDCU-HC

Payment & Shipping Terms:

Minimum Order Quantity:	Negotiation
Price:	Negotiation
Packaging Details:	Standard wooden carton
Delivery Time:	5-20days
Payment Terms:	T/T, L/C
Supply Ability:	1000 Ton per month

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Detailed Product Description

Purity:	99.95%	Thickness:	70um,35um
Color:	Red Or Black	Standard:	IPC-4562
Inter Diameter:	76 Mm	Products Name:	1290mm Width HTE CU Foil Copper Foil Vendor In 35 & 70um For PCB Laminate
Highlight:	electrodeposited copper foil , copper thin sheet

1290mm width HTE CU foil copper foil vendor in 35 & 70um for PCB laminate

Detail Specification:

Single side treatment in red. and single Side Shiny

Thickness: 70um & 35um

Width range: 5-1380mm,and standard width:1290mm,max 1380mm width

high temperature elongation copper foil :120 min (180 °C in Atmosphere)

Internal diameter: 76MM

Standard :IPC-4562

Copper foil Application


Application	2>PCB manufacture
	3>antenna PCB
	4>PCB laminate 5>Multi-layer printed circuit boards/Multi-layer PCB

Features and advantages

1.The thermally stable microstructures with their stable mechanical properties

2. Improve dimensional stability

3.Reduce bulging, warping and nail head formation.

These resist thermal outliers which typically occur during laminates.

HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).

Thickness		um	18	25	35	70	IPC 4562 4.6.3.1
Area weight		g/m²	153±	215±5	285±5	585±8	IPC 4562 4.6.3.2
Roughness	(RA)	μm	0.2-0.4	0.2-0.4	0.2-0.4	0.2-0.4	IPC 4562 4.6.9
Roughness	(RZ)	μm	<8.0	<9.0	≤10.0	<15	IPC 4562 4.6.9
Copper≧		%	99.8				IPC 4562 4.6.3.1
Tensile Strength	state normal	Mpa	>300	>300	>300	>280	IPC 4562 4.6.4
Tensile Strength	state temper (180℃)	Mpa	>18.0	>18.0	>18.0	>18.0	IPC 4562 4.6.4
ElongationI	state normal	%	>5.0	>6.0	>10.0	>10.0	IPC 4562 3.5.3
ElongationI	state temper (180℃)	%	>2.5	>3.0	>5.0	>5.0	IPC 4562 3.5.3
Peel strength		N/mm	>1.35	>1.70	>1.8	>2.0	IPC 4562 4.6.7
High temperature oxidation resistance(200℃, 40min)		No color change					Standard
Solderability		Good					Standard
Solderability		Good					IPC 4562 4.6.12