JIMA Copper 86-21-35322273 cufoil@jimagroup.com
LP Low Profile ED Copper Foil 18um 35um For Mobile Phone

LP Low Profile ED Copper Foil 18um 35um For Mobile Phone

  • High Light

    edco copper foil

    ,

    hvlp copper foil

  • Purity
    99.8%
  • Pinholes
    None
  • Anti Oxidation
    200 Degree 60 Minutes, 180 Days 23 Degree
  • Thickness
    105um 8um 35um
  • Color
    Red Or Black
  • Elongation
    ≥ 5%
  • Tensile Strength
    ≥ 180 MPa
  • Peel Strength
    ≥ 1 N/mm
  • Foil Profile
    RA≤2.5μm,Rz≤4.0μm
  • Place of Origin
    china
  • Brand Name
    JIMA
  • Certification
    SGS, ISO,Reach, RoHS
  • Model Number
    EDCULP
  • Minimum Order Quantity
    100kg
  • Price
    usd 15-20 kg
  • Packaging Details
    wooden carton
  • Delivery Time
    5-15 days
  • Supply Ability
    1000 Ton per month

LP Low Profile ED Copper Foil 18um 35um For Mobile Phone

LP Low Profile ED Copper Foil 18um 35um For Mobile Phone

 

Matte side treatment low profile foil in back/red.

Features:

1. the treated foil in gray or red

2. High profile with properties of LP-S-B/R suitable for FCCL

3. Grain structure of copper foil leads to high flexibility

4. Excellent etching performance

5. low profile enables to make fine circuit pattern

Application:

1. Casting and lamination type FCCL

2. Super fine pattern FPC

3. Chip on flex (COF) for LED

LP Low Profile ED Copper Foil 18um 35um For Mobile Phone 0

 

Typical properties of LP-S-B/R ED electrolytic copper foil(for FPC or inner layer of HDI)

Classification

 

Unit Requirement Test Method
Foil Designation /   1 H M 1 IPC-4562A
Nominal thickness / 10um 12um 1/2 OZ(18um) 3/4 OZ(25um) 1 OZ(35um) IPC-4562A
Area Weight g/㎡ 98±4 107±4 153±5 228±8 285±10

IPC-TM-650

2.2.12.2

Purity ≥99.8

IPC-TM-650

2.3.15

Foil Profile Shiny side(Ra) սm ≤2.5 ≤2.5 ≤2.5 ≤2.5 ≤2.5

IPC-TM-650

2.3.17

Matte side(Rz) um ≤4.0 ≤4.5 ≤5.5 ≤6.0 ≤8.0
Tensile Strength R.T.(23℃) Mpa ≥260 ≥260 ≥280 ≥280 ≥280

IPC-TM-650

2.3.18

H.T.(180℃) Mpa ≥180 ≥180 ≥180 ≥180 ≥180
Elongation R.T.(23℃) ≥5 ≥6 ≥8 ≥10 ≥12

IPC-TM-650

2.3.18

H.T.(180℃) ≥5 ≥6 ≥7 ≥8 ≥8
Peel Strength(FR-4) N/mm 0.7 0.8 1.0 1.1 1.2

IPC-TM-650

2.4.8

Ibs/in 4 4.6 5.7 6.3 6.9
Pinholes&porosity Number No

IPC-TM-650

2.1.2

Anti-oxidization R.T.(23℃) 180days /
H.T.(200℃) 60 Minutes /

1.Standard Width 520mm,max width 1295(±1)mm,May according to the customer request tailor.

We test the peel strength with PI ,please reconfirm with your pp.

 

Photos share

LP Low Profile ED Copper Foil 18um 35um For Mobile Phone 1