JIMA Copper 86-21-35322273 cufoil@jimagroup.com
Low Profile PCB Copper Foil 12um 18um 25um 35um 50um 70um 105um

Low Profile PCB Copper Foil 12um 18um 25um 35um 50um 70um 105um

  • High Light

    High Density Circuit Boards Copper Foil

    ,

    25um Multilayered Pcbs Copper Foil

    ,

    PCB Copper Foil 35um

  • Application
    3layer FCCL,EMI
  • Thickness
    12um 18um 25um 35um 50um 70um 105um
  • Standard Width
    1290mm, We Can Cut As Size Requirement
  • ID
    76mm,152mm
  • Lead Time
    7-10days
  • Sample
    Can Be Supply
  • Place of Origin
    China
  • Brand Name
    JIMA
  • Certification
    SGS, ISO,Reach, RoHS
  • Model Number
    RAPCB09
  • Minimum Order Quantity
    50kg
  • Price
    Negotiation
  • Packaging Details
    Wooden box package
  • Delivery Time
    5-15 days
  • Payment Terms
    T/T, L/C
  • Supply Ability
    1000 Ton per month

Low Profile PCB Copper Foil 12um 18um 25um 35um 50um 70um 105um

Low Profile Copper Foil Thickness 12um 18um 25um 35um 50um 70um 105um

 

Detail:

  • Nominal Thickness:12um 18um 25um 35um 50um 70um 105um
  • Wooden box package
  • Standard Width: 1290mm, can be cutting as size request
  • Length: Customized
  • Sample can be supply
  • Delivery: 10-20days

​Features:

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

  • Low profile for FCCL
  • High MIT
  • Excellent etchability
  • The treated foil is pink or black

​Typical Application

  • 3layer FCCL
  • EMI

Typical Properties of Low Profile Copper Foil

Classification Unit Requirement Test Method
Nominal thickness um 12 18 25 35 50 70 105 IPC-4562A
Area Weight g/m² 107±5 153±7 225±8 285± 10 435±15 585± 20 870±30 IPC-TM-650 2.2.12.2
Purity % ≥99.8 IPC-TM-650 2.3.15
Roughness Shiny side (Ra) սm ≤0.43 IPC-TM-650 2.3.17
Matte side(Rz) um ≤4.5 ≤5.0 ≤6.0 ≤7.0 ≤8.0 ≤12 ≤14
Tensile Strength R.T.(23°C) Mpa ≥207 ≥276 IPC-TM-650 2.4.18
H.T.(180°C) ≥138
Elongation R.T.(23°C) % ≥4 ≥4 ≥5 ≥8 ≥10 ≥12 ≥12 IPC-TM-650 2.4.18
H.T.(180°C ≥4 ≥4 ≥5 ≥6 ≥8 ≥8 ≥8
Resistivity Ω.g/m² ≤0.170 ≤0.166   ≤0.162   ≤0.162 ≤0.162 IPC-TM-650 2.5.14
Peel Strength(FR-4) N/mm ≥1.0 ≥1.3   ≥1.6   ≥1.6 ≥2.1 IPC-TM-650 2.4.8
Pinholes & Porosity Number / / No IPC-TM-650 2.1.2
Anti-oxidization R.T.(23°C) Days / / 180 /
H.T.(200°C) Minutes / / 30 /

 

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

Low Profile PCB Copper Foil 12um 18um 25um 35um 50um 70um 105um 0

Low Profile PCB Copper Foil 12um 18um 25um 35um 50um 70um 105um 1