JIMA Copper 86-21-35322273 cufoil@jimagroup.com
Thickness 12um 18um 35um 50um 70um Very Low Profile Copper Foil for Mobile Phone Wireless Charging

Thickness 12um 18um 35um 50um 70um Very Low Profile Copper Foil for Mobile Phone Wireless Charging

  • Application
    2layer 3layer FPC,EMI,Fine Circuit Pattern,Mobile Phone Wireless Charging
  • Thickness
    12um 18um 35um 50um 70um
  • Width Range
    200-1300mm, Can Be Cutting As Per Size Request.
  • ID
    76mm,152mm
  • Lead Time
    7-10days
  • Sample
    Can Be Supply
  • Length
    Customized
  • Place of Origin
    China
  • Brand Name
    JIMA
  • Certification
    SGS, ISO,Reach, RoHS
  • Model Number
    RAPCB09
  • Minimum Order Quantity
    50kg
  • Price
    Negotiation
  • Packaging Details
    Wooden box package
  • Delivery Time
    5-15 days
  • Payment Terms
    T/T, L/C
  • Supply Ability
    1000 Ton per month

Thickness 12um 18um 35um 50um 70um Very Low Profile Copper Foil for Mobile Phone Wireless Charging

Thickness 12um 18um 35um 50um 70um Very Low Profile Copper Foil for Mobile Phone Wireless Charging

 
Sub-micron micro-roughening treatment significantly increases surface area without affecting roughness, which is especially helpful for increasing adhesion strength. With high particle adhesion, there is no worry of particles falling off and contaminating lines. The Rzjis value after roughening is maintained at 1.0 µm and transparency of the film after being etched is also good.

Detail

  • Nominal Thickness:12um 18um 35um 50um 70um
  • Standard Width: 200-1300mm, can be cutting as per size request.
  • Wooden Box Package
  • ID: 76 mm, 152 mm
  • Length: Customized
  • Sample:Can be supply

 

​Features

 

The treated foil is pink or black electrolytic copper foil of very low surface roughness. Compared with regular electrolytic copper foil, this VLP foil has finer crystals, which are equiaxed ones with flat ridges, have a surface roughness of 0.55μm, and have such merits as better size stability and higher hardness. This product is applicable to high-frequency and high-speed materials, mainly flexible circuit boards, high-frequency circuit boards, and ultra-fine circuit boards.

  • Very Low profile
  • High MIT
  • Excellent etchability

​Typical Application

  • 2layer 3layer FPC
  • EMI
  • Fine circuit pattern
  • Mobile phone Wireless charging
  • High frequency board

Typical Properties of Very Low Profile Copper Foil

Classification Unit Requirement Test Method
Nominal thickness um 12 18 35 50 70 IPC-4562A
Area Weight g/m² 107±5 153±7 285± 10 435±15 585± 20 IPC-TM-650 2.2.12.2
Purity % ≥99.8 IPC-TM-650 2.3.15
Roughness Shiny side (Ra) սm ≤0.43 IPC-TM-650 2.3.17
Matte side(Rz) um ≤3.0 ≤3.0 ≤3.0 ≤3.0 ≤3.0
Tensile Strength R.T.(23°C) Mpa ≥300 IPC-TM-650 2.4.18
H.T.(180°C) ≥180
Elongation R.T.(23°C) % ≥5 ≥6 ≥8 ≥10 ≥10 IPC-TM-650 2.4.18
H.T.(180°C ≥6 ≥6 ≥6 ≥6 ≥6
Peel Strength(FR-4) N/mm ≥0.8 ≥0.8 ≥1.0 ≥1.2 ≥1.4 IPC-TM-650 2.4.8
lbs/in ≥4.6 ≥4.6 ≥5.7 ≥6.8 ≥8.0
Pinholes & Porosity Numbers No IPC-TM-650 2.1.2
Anti-oxidization R.T.(23°C) Days 180 /
H.T.(200°C) Minutes 30                  /

 

Thickness 12um 18um 35um 50um 70um Very Low Profile Copper Foil for Mobile Phone Wireless Charging 0