Thickness 12um 18um 35um 50um 70um Very Low Profile Copper Foil for Mobile Phone Wireless Charging

Product Details:

Place of Origin:	China
Brand Name:	JIMA
Certification:	SGS, ISO,Reach, RoHS
Model Number:	RAPCB09

Payment & Shipping Terms:

Minimum Order Quantity:	50kg
Price:	Negotiation
Packaging Details:	Wooden box package
Delivery Time:	5-15 days
Payment Terms:	T/T, L/C
Supply Ability:	1000 Ton per month

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Detailed Product Description

Application::	2layer 3layer FPC,EMI,Fine Circuit Pattern,Mobile Phone Wireless Charging	Thickness:	12um 18um 35um 50um 70um
Width Range:	200-1300mm, Can Be Cutting As Per Size Request.	ID:	76mm，152mm
Lead Time:	7-10days	Sample:	Can Be Supply
Length:	Customized
Highlight:	Wireless Charging Copper Foil , Mobile Phone Copper Foil , Low Profile Copper Foil

Thickness 12um 18um 35um 50um 70um Very Low Profile Copper Foil for Mobile Phone Wireless Charging

Sub-micron micro-roughening treatment significantly increases surface area without affecting roughness, which is especially helpful for increasing adhesion strength. With high particle adhesion, there is no worry of particles falling off and contaminating lines. The Rzjis value after roughening is maintained at 1.0 µm and transparency of the film after being etched is also good.

Detail

Nominal Thickness:12um 18um 35um 50um 70um
Standard Width: 200-1300mm, can be cutting as per size request.
Wooden Box Package
ID: 76 mm, 152 mm
Length: Customized
Sample:Can be supply

Features

The treated foil is pink or black electrolytic copper foil of very low surface roughness. Compared with regular electrolytic copper foil, this VLP foil has finer crystals, which are equiaxed ones with flat ridges, have a surface roughness of 0.55μm, and have such merits as better size stability and higher hardness. This product is applicable to high-frequency and high-speed materials, mainly flexible circuit boards, high-frequency circuit boards, and ultra-fine circuit boards.

Very Low profile
High MIT
Excellent etchability

Typical Application

2layer 3layer FPC
EMI
Fine circuit pattern
Mobile phone Wireless charging
High frequency board

Typical Properties of Very Low Profile Copper Foil

Classification		Unit	Requirement					Test Method
Nominal thickness		um	12	18	35	50	70	IPC-4562A
Area Weight		g/m²	107±5	153±7	285± 10	435±15	585± 20	IPC-TM-650 2.2.12.2
Purity		%	≥99.8					IPC-TM-650 2.3.15
Roughness	Shiny side (Ra)	սm	≤0.43					IPC-TM-650 2.3.17
Roughness	Matte side(Rz)	um	≤3.0	≤3.0	≤3.0	≤3.0	≤3.0	IPC-TM-650 2.3.17
Tensile Strength	R.T.(23°C)	Mpa	≥300					IPC-TM-650 2.4.18
Tensile Strength	H.T.(180°C)	Mpa	≥180					IPC-TM-650 2.4.18
Elongation	R.T.(23°C)	%	≥5	≥6	≥8	≥10	≥10	IPC-TM-650 2.4.18
Elongation	H.T.(180°C	%	≥6	≥6	≥6	≥6	≥6	IPC-TM-650 2.4.18
Peel Strength(FR-4)		N/mm	≥0.8	≥0.8	≥1.0	≥1.2	≥1.4	IPC-TM-650 2.4.8
Peel Strength(FR-4)		lbs/in	≥4.6	≥4.6	≥5.7	≥6.8	≥8.0	IPC-TM-650 2.4.8
Pinholes & Porosity		Numbers	No					IPC-TM-650 2.1.2
Anti-oxidization	R.T.(23°C)	Days	180					/
Anti-oxidization	H.T.(200°C)	Minutes	30					/

Thickness 12um 18um 35um 50um 70um Very Low Profile Copper Foil for Mobile Phone Wireless Charging 0

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