JIMA Copper 86-21-35322273
35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL

35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL

  • High Light

    Electrolytic HTE Copper Foil

    ,

    35um HTE Copper Foil

    ,

    35um electrolytic copper foil

  • Purity
    99.95%
  • Name
    35um HTE Electrolytic Copper Foil 1oz For Rigid PCB And CCL
  • Thickness
    1/2 Oz,3/4 Oz,1 Oz,2 Oz,
  • Color
    Red Or Black
  • Elongation
    ≥ 1.5%
  • Tensile Strength
    ≥ 160 MPa
  • Peel Strength
    ≥ 1 N/mm
  • Foil Profile
    RA≤0.15μm,Rz≤1.7μm
  • Length Per Roll
    500 - 5000 Meter
  • Inter Diameter
    76 Mm,152 Mm, 3 Inch,6 Inch
  • Place of Origin
    China
  • Brand Name
    JIMA
  • Certification
    SGS, ISO,Reach, RoHS
  • Model Number
    EDCU-HC
  • Minimum Order Quantity
    100kg
  • Price
    Negotiation
  • Packaging Details
    wooden carton
  • Delivery Time
    5-15 days
  • Payment Terms
    T/T, L/C
  • Supply Ability
    1000 Ton per month

35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL

 
35um HTE Electrolytic Copper Foil 1oz For Rigid PCB and CCL
 
Detail Specification:

Single side treatment in red.
Nominal Thickness: 0.012-0.070 mm,35um,70um 
Width range: 100-1380mm,standard width:1290mm
Length range : 500-5000 M
Internal diameter: 3 inch,6 inch.
Sample: can be supply

 
Classify:
 
(STD-E)- standard electrodeposited copper foil.
(HD-E)-high ductility electrodeposited copper foil.
(HTE-E)-high temperature elongation electrodeposited copper foil.
 
35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL 0
HTE Copper Foil Application

  PCB industry .
Application PCB manufacture
  antenna PCB,Epoxy board
  Epoxy board
  Rigid PCB 
  CCL

FAQ:

Q1: Can you customize the special size as per our requirement?
A:we can cut into as your request size.

Q16. How to save after the box opened?
A: Keep the dry environment,and is better use it in 30days.

Q4: Can you supply the sample?
A: We can supply A4 samples

 
HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).

Thickness um 9 12 18 25 35 70

IPC 4562

4.6.3.1

Area weight g/m² 80±1 107±3 153± 215±5 285±5 585±8

IPC 4562

4.6.3.2

Roughness (RA) μm 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4

IPC 4562

4.6.9

(RZ) μm <6.0 <6.5 <8.0 <9.0 ≤10.0 <15

 

Copper≧

% 99.8

IPC 4562

4.6.3.1

Tensile Strength state normal Mpa >300 >300 >300 >300 >300 >280

IPC 4562

4.6.4

state temper (180℃) Mpa >15.0 >18.0 >18.0 >18.0 >18.0 >18.0
ElongationI state normal % >3.0 >3.0 >5.0 >6.0 >10.0 >10.0

IPC 4562

3.5.3

state temper (180℃) % >2.0 >2.5 >2.5 >3.0 >5.0 >5.0
Peel strength N/mm >1.0 >1.05 >1.35 >1.70 >1.8 >2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

No color change Standard
Solderability Good Standard
Solderability Good

IPC 4562

4.6.12

3. Standard Width,1295(±1)mm,May according to the customer request tailor.
We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp
Packing photos :
35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL 1