JIMA Copper 86-21-35322273
Zinc Free 3 / 4 OZ HTE Copper Foil For CCL 500 - 5000 Meter Length Per Roll

Zinc Free 3 / 4 OZ HTE Copper Foil For CCL 500 - 5000 Meter Length Per Roll

  • High Light

    electrodeposited copper foil

    ,

    copper thin sheet

  • Anti Oxidation
    180 Degree 60 Minutes, 180 Days 23 Degree
  • Elongation
    ≥ 1.5%
  • Tensile Strength
    ≥ 160 MPa
  • Peel Strength
    ≥ 1 N/mm
  • Foil Profile
    RA≤0.15μm,Rz≤1.7μm
  • Length Per Roll
    500 - 5000 Meter
  • Place of Origin
    china
  • Brand Name
    JIMA
  • Certification
    SGS, ISO,Reach, RoHS
  • Model Number
    EDCU-HC
  • Minimum Order Quantity
    100kg
  • Price
    negotiation
  • Packaging Details
    wooden carton
  • Delivery Time
    5-15 days
  • Payment Terms
    T/T, L/C
  • Supply Ability
    1000 Ton per month

Zinc Free 3 / 4 OZ HTE Copper Foil For CCL 500 - 5000 Meter Length Per Roll

FR-4 zinc-free 3/4 OZ red HTE electrodeposited copper foil for CCL

 

 

Feature:

 

- Being used in the production of the different double-face and multi-player printed circuit boards.

- Perfect physical characteristic of the fine and uniform crystal structure.

- Low profile, the high intensity,high peel strength.

 

Specification as follow:

 

. Thickness: 3/4 OZ, 25 mic.

. Quality standard:IPC 4562.

. Small coil.

. Jumbo coil.

 

Classify:

 

(HD-E)-high ductility electrodeposited copper foil.

(HTE-E)-high temperature elongation electrodeposited copper foil.

(LP-E)-low profile electrodeposited copper foil.

 

 

Application:

 

1. Epoxy board.

2. PCB ,antenna PCB,PCB industry

 

So what the differences between rolled copper foil and ED copper foil

 

rolled copper foil higher density, the surface is relatively smooth, conducive to the production of printed circuit board after the rapid transmission of the signal, so high-frequency high-speed transmission, fine lines printed circuit board also used some calendering copper Foil.

 

HTE copper foil with high elongation copper foil at high temperature

Thickness um 9 12 18 25 35 70

IPC 4562

4.6.3.1

 

Area weight g/m² 80±1 107±3 153± 215±5 285±5 585±8

IPC 4562

4.6.3.2

Roughness (RA) μm 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4

IPC 4562

4.6.9

(RZ) μm <6.0 <6.5 <8.0 <9.0 ≤10.0 <15

 

Copper≧

% 99.8

IPC 4562

4.6.3.1

 

Tensile Strength state normal Mpa >300 >300 >300 >300 >300 >280

IPC 4562

4.6.4

state temper (180℃) Mpa >15.0 >18.0 >18.0 >18.0 >18.0 >18.0
ElongationI state normal % >3.0 >3.0 >5.0 >6.0 >10.0 >10.0

IPC 4562

3.5.3

state temper (180℃) % >2.0 >2.5 >2.5 >3.0 >5.0 >5.0
Peel strength N/mm >1.0 >1.05 >1.35 >1.70 >1.8 >2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

No color change Standard
Solderability Good Standard
Solderability Good

IPC 4562

4.6.12