JIMA Copper 86-21-35322273
Good Etch Ability Copper Foil Sheet HTE 17um For High Speed Circuit / CCL

Good Etch Ability Copper Foil Sheet HTE 17um For High Speed Circuit / CCL

  • High Light

    edco copper foil

    ,

    copper foil paper

  • Name
    HTE 17um ED Copper Foil For High Speed Circuit With Good Etch Ability
  • Standard
    IPC 4562
  • Package
    Standard Wooden Box
  • Application
    Pcb/ CCL
  • Thickness
    17um,0.017mm
  • Weight
    100~500kgs/roll
  • Place of Origin
    CHINA
  • Brand Name
    JIMA
  • Certification
    ISO9001:2008,ISO14001:2004,T28001-2011
  • Model Number
    EDCUHTE
  • Minimum Order Quantity
    Negotiations
  • Price
    Negotiations
  • Packaging Details
    wooden box
  • Delivery Time
    10~20days
  • Payment Terms
    L/C, T/T
  • Supply Ability
    6000MT per year

Good Etch Ability Copper Foil Sheet HTE 17um For High Speed Circuit / CCL

HTE 17um ED copper foil for High speed circuit with Good etch ability.

 

Products Detail:

a.single side side treatment low profile foil in back/red.

b.Nominal Thickness: 0.017mm.

c.Width: 5-1380mm,standard width:1290mm.

d.ID: 76 mm,152 mm.

e.Cu purity :99.8%.

f.Quality standard:IPC 4562.

 

Products use Application:

1.Polyimide board

2.Epoxy board

3.PCB and antenna PCB,FPC

 

Description.

.Excellent adhesion to etching resist..

.Anti foil cracking by high elongation at elevated temperature.

.Eco-friendly products and processes.

Compare between CA copper foil and ED copper foil

1. Density: rolled copper foil higher density, the surface is relatively smooth, conducive to the production of printed circuit board after the rapid transmission of the signal, so high-frequency high-speed transmission, fine lines printed circuit board also used some calendering copper Foil.

2. Surface treatment width:rolled copper foil be limited by Surface treatment widest effective width of 520mm.

HTE copper foil Technical Parameters sheet (high elongation copper foil at high temperature)

Thickness um 9 12 18 25 35 70

IPC 4562

4.6.3.1

Area weight g/m² 80±1 107±3 153± 215±5 285±5 585±8

IPC 4562

4.6.3.2

Roughness (RA) μm 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4

IPC 4562

4.6.9

(RZ) μm <6.0 <6.5 <8.0 <9.0 ≤10.0 <15

 

Copper≥

% 99.8

IPC 4562

4.6.3.1

Tensile Strength state normal Mpa >300 >300 >300 >300 >300 >280

IPC 4562

4.6.4

state temper (180℃) Mpa >15.0 >18.0 >18.0 >18.0 >18.0 >18.0
ElongationI state normal % >3.0 >3.0 >5.0 >6.0 >10.0 >10.0

IPC 4562

3.5.3

state temper (180℃) % >2.0 >2.5 >2.5 >3.0 >5.0 >5.0
Peel strength N/mm >1.0 >1.05 >1.35 >1.70 >1.8 >2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

No color change Standard
Solderability Good Standard
Solderability Good

IPC 4562

4.6.12

Remark:

1.Standard Width,1295(±1)mm,May according to the customer request tailor.

2.We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.

 

FAQ:

Q1. Is it possible be zinc free copper foil?

Yes ,we can do it.

Q2. Can you provide COA?

Yes , we can.

Q3. Is it the Fumigation carton box?

Yes ,it is .