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ED Copper Foil

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October 21, 2020
Category Connection: Electrolytic Copper Foil
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Tags:
#copper sheet plate #pure copper foil #copper foil sheet roll
Brief: Discover the 25um LP ED Copper Foil for FPC, featuring high temperature resistance and superior conductivity. Ideal for flexible printed circuits, this copper foil ensures fine circuit patterns and high strength. Perfect for FCCL, COF for LED, and multilayer circuit boards.
Related Product Features:
  • 25um thickness for precision in flexible printed circuits.
  • High temperature resistance up to 180°C for durability.
  • Low profile enables fine circuit pattern creation.
  • High strength and toughness for reliable performance.
  • Standard width of 1290mm, expandable to 1380mm.
  • Suitable for FCCL, COF for LED, and multilayer boards.
  • Excellent peel strength for secure bonding.
  • Anti-oxidization properties ensure long-term reliability.
Faqs:
  • What is the thickness range of the LP ED Copper Foil?
    The LP ED Copper Foil has a thickness range of 25um, making it ideal for precision applications in flexible printed circuits.
  • What are the key features of this copper foil?
    Key features include high temperature resistance, low profile for fine circuits, high strength, and excellent peel strength for secure bonding.
  • What applications is this copper foil suitable for?
    This copper foil is perfect for Flexible Copper Clad Laminate (FCCL), Chip on Flex (COF) for LED, and multilayer circuit boards.
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