Send Message
Home ProductsHTE Copper Foil

35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL

35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL

  • 35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL
35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL
Product Details:
Place of Origin: China
Brand Name: JIMA
Certification: SGS, ISO,Reach, RoHS
Model Number: EDCU-HC
Payment & Shipping Terms:
Minimum Order Quantity: 100kg
Price: Negotiation
Packaging Details: wooden carton
Delivery Time: 5-15 days
Payment Terms: T/T, L/C
Supply Ability: 1000 Ton per month
Contact Now
Detailed Product Description
Purity: 99.95% Name: 35um HTE Electrolytic Copper Foil 1oz For Rigid PCB And CCL
Thickness: 1/2 Oz,3/4 Oz,1 Oz,2 Oz, Color: Red Or Black
Elongation: ≥ 1.5% Tensile Strength: ≥ 160 MPa
Peel Strength: ≥ 1 N/mm Foil Profile: RA≤0.15μm,Rz≤1.7μm
Length Per Roll: 500 - 5000 Meter Inter Diameter: 76 Mm,152 Mm, 3 Inch,6 Inch
High Light:

Electrolytic HTE Copper Foil

,

35um HTE Copper Foil

,

35um electrolytic copper foil

 
35um HTE Electrolytic Copper Foil 1oz For Rigid PCB and CCL
 
Detail Specification:

Single side treatment in red.
Nominal Thickness: 0.012-0.070 mm,35um,70um 
Width range: 100-1380mm,standard width:1290mm
Length range : 500-5000 M
Internal diameter: 3 inch,6 inch.
Sample: can be supply

 
Classify:
 
(STD-E)- standard electrodeposited copper foil.
(HD-E)-high ductility electrodeposited copper foil.
(HTE-E)-high temperature elongation electrodeposited copper foil.
 
35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL 0
HTE Copper Foil Application

  PCB industry .
Application PCB manufacture
  antenna PCB,Epoxy board
  Epoxy board
  Rigid PCB 
  CCL

FAQ:

Q1: Can you customize the special size as per our requirement?
A:we can cut into as your request size.

Q16. How to save after the box opened?
A: Keep the dry environment,and is better use it in 30days.

Q4: Can you supply the sample?
A: We can supply A4 samples

 
HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).

Thickness um 9 12 18 25 35 70

IPC 4562

4.6.3.1

Area weight g/m² 80±1 107±3 153± 215±5 285±5 585±8

IPC 4562

4.6.3.2

Roughness (RA) μm 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4

IPC 4562

4.6.9

(RZ) μm <6.0 <6.5 <8.0 <9.0 ≤10.0 <15

 

Copper≧

% 99.8

IPC 4562

4.6.3.1

Tensile Strength state normal Mpa >300 >300 >300 >300 >300 >280

IPC 4562

4.6.4

state temper (180℃) Mpa >15.0 >18.0 >18.0 >18.0 >18.0 >18.0
ElongationI state normal % >3.0 >3.0 >5.0 >6.0 >10.0 >10.0

IPC 4562

3.5.3

state temper (180℃) % >2.0 >2.5 >2.5 >3.0 >5.0 >5.0
Peel strength N/mm >1.0 >1.05 >1.35 >1.70 >1.8 >2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

No color change Standard
Solderability Good Standard
Solderability Good

IPC 4562

4.6.12

3. Standard Width,1295(±1)mm,May according to the customer request tailor.
We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp
Packing photos :
35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL 1
 

Contact Details
JIMA Copper

Contact Person: JIMA Annie

Send your inquiry directly to us (0 / 3000)

Other Products