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Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards

Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards

  • High Light

    roll of copper foil

    ,

    electrodeposited copper foil

  • Purity
    99.95%
  • Thickness
    70um,35um
  • Color
    Red Or Black
  • Standard
    IPC-4562
  • Inter Diameter
    76 Mm,152 Mm, 3 Inch,6 Inch
  • Products Name
    Electrolytic HTE Copper Foil With Thickness 35um For PCB Laminate Multi-layer Printed Circuit Boards Multi-layer PCB
  • High Temperature Elongation Copper Foil
    120 Min (180 °C In Atmosphere)
  • Place of Origin
    China
  • Brand Name
    JIMA
  • Certification
    SGS, ISO,Reach, RoHS
  • Model Number
    EDCU-HC
  • Minimum Order Quantity
    200kg
  • Price
    negotiation
  • Packaging Details
    Standard wooden carton
  • Delivery Time
    5-25days
  • Payment Terms
    T/T, L/C
  • Supply Ability
    1000 Ton per month

Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards

Electrolytic HTE Copper Foil with thickness 35um For PCB laminate Multi-layer printed circuit boards Multi-layer PCB

 

Detail Specification:

Single side treatment in red. and single Side Shiny
Thickness: 70um and 35um
Width range: 5-1380mm,and standard width:1290mm,max 1380mm width

high temperature elongation copper foil :120 min (180 °C in Atmosphere)

Internal diameter: 3 inch/6 inch.
Standard :IPC-4562

 

Classify:

 

1.(STD-E)- standard electrodeposited copper foil.

2.(HD-E)-high ductility electrodeposited copper foil.

3.(HTE-E)-high temperature elongation electrodeposited copper foil.

 

Copper foil Application

   
Application 2>PCB manufacture
  3>antenna PCB
 

4>PCB laminate

5>Multi-layer printed circuit boards/Multi-layer PCB 

 

Features and advantages

1.The thermally stable microstructures with their stable mechanical properties

2. Improve dimensional stability

3.Reduce bulging, warping and nail head formation.

These resist thermal outliers which typically occur during laminates.


 

HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).

Thickness um 18 25 35 70

IPC 4562

4.6.3.1

Area weight g/m² 153± 215±5 285±5 585±8

IPC 4562

4.6.3.2

Roughness (RA) μm 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4

IPC 4562

4.6.9

(RZ) μm <8.0 <9.0 ≤10.0 <15

 

Copper≧

% 99.8

IPC 4562

4.6.3.1

Tensile Strength state normal Mpa >300 >300 >300 >280

IPC 4562

4.6.4

state temper (180℃) Mpa >18.0 >18.0 >18.0 >18.0
ElongationI state normal % >5.0 >6.0 >10.0 >10.0

IPC 4562

3.5.3

state temper (180℃) % >2.5 >3.0 >5.0 >5.0
Peel strength N/mm >1.35 >1.70 >1.8 >2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

No color change Standard
Solderability Good Standard
Solderability Good

IPC 4562

4.6.12

3. Standard Width,1290(±1)mm,May according to the customer request tailor.

 

 

Package detail:wooden box 

Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards 0

RFQ:
Q1: What's your guarantee?
A: All our products have 6 months guarantee after received goods, if any quality problem can contact us.
 
Q2: What's your delivery time ?
A: The common delivery time is 5-25working days. depend on your order quanity
 
Q4: Can you supply the sample?
A: Yes,We can
 
Q5. Do you test all your goods before delivery?
A: Yes, we have 100% test before delivery.
 
Q6. Can you cut into size as request?
Yes, we can.
 
Q9. Can we come to China visit factory ?
Yes ,you can .