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Low Profile Copper Foil 50um 70um 90um With Red Color For Samsung Phone Heat Sink

China Low Profile Copper Foil 50um 70um 90um With Red Color For Samsung Phone Heat Sink supplier

Large Image :  Low Profile Copper Foil 50um 70um 90um With Red Color For Samsung Phone Heat Sink

Product Details:

Place of Origin: China
Brand Name: JIMA
Certification: SGS, ISO,Reach, RoHS
Model Number: EDCU-LP

Payment & Shipping Terms:

Minimum Order Quantity: 100kg
Price: negotiation
Packaging Details: wooden carton
Delivery Time: 5-15 days
Payment Terms: T/T, L/C
Supply Ability: 1000 Ton per month
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Detailed Product Description
Purity: 99.95% Name: Low Profile Copper Foil 50um 70um 90um With Red Color For Samsung Phone Heat Sink
Color: Red Or Black Tensile Strength: ≥ 160 MPa
Thickness: 50um 70um 90um Application:: FCCL,FPC,Samsung Phone Heat Sink

Low Profile Copper Foil 50um 70um 90um With Red Color For Samsung Phone Heat Sink

 

Application of LP copper foil.

 

For Super fine pattern FPC.

And multilayer circuit boards.

Samsung Phone Heat Sink

 

 

Specification reference.

 

Standard Width 1290mm,max width 1380(±1)mm,May according to the customer reque.

Thickness Range: 0.012~0.070 mm.

ID: 76 mm,152 mm.

 

Packaing:

 

 

Different between CA copper foil and ED copper foil.

 

1. Process: rolled copper foil (Rolling process),ED copper foil (Electrodeposition process).

2. Strength toughness: rolled copper foil is a flaky crystalline structure, so the strength and toughness is better than electrolytic copper foil, so most of the rolling copper foil used in flexible printed circuit boards.

 

LP/low profile copper foil of Properties.

Classification

 

Unit Requirement Test Method
Foil Designation /   1 H M 1 IPC-4562A
Nominal thickness / 10um 12um 1/2 OZ(18um) 3/4 OZ(25um) 1 OZ(35um) IPC-4562A
Area Weight g/㎡ 98±4 107±4 153±5 228±8 285±10

IPC-TM-650

2.2.12.2

Purity ≥99.8

IPC-TM-650

2.3.15

Foil Profile Shiny side(Ra) սm ≤2.5 ≤2.5 ≤2.5 ≤2.5 ≤2.5

IPC-TM-650

2.3.17

Matte side(Rz) um ≤4.0 ≤4.5 ≤5.5 ≤6.0 ≤8.0
Tensile Strength R.T.(23℃) Mpa ≥260 ≥260 ≥280 ≥280 ≥280

IPC-TM-650

2.3.18

H.T.(180℃) Mpa ≥180 ≥180 ≥180 ≥180 ≥180
Elongation R.T.(23℃) ≥5 ≥6 ≥8 ≥10 ≥12

IPC-TM-650

2.3.18

H.T.(180℃) ≥5 ≥6 ≥7 ≥8 ≥8
Peel Strength(FR-4) N/mm 0.7 0.8 1.0 1.1 1.2

IPC-TM-650

2.4.8

Ibs/in 4 4.6 5.7 6.3 6.9
Pinholes&porosity Number No

IPC-TM-650

2.1.2

Anti-oxidization R.T.(23℃) 180days /
H.T.(200℃) 60 Minutes /

Contact Details
JIMA Copper

Contact Person: Mr.huang

Tel: +8615000729029

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