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3 OZ Electrolytic Rolled Copper Foil , High Ductility Ultra Thin Copper Foil

3 OZ Electrolytic Rolled Copper Foil , High Ductility Ultra Thin Copper Foil

  • 3 OZ Electrolytic Rolled Copper Foil , High Ductility Ultra Thin Copper Foil
3 OZ Electrolytic Rolled Copper Foil , High Ductility Ultra Thin Copper Foil
Product Details:
Place of Origin: china
Brand Name: JIMA
Certification: SGS, ISO,Reach, RoHS
Model Number: EDCU-HC
Payment & Shipping Terms:
Minimum Order Quantity: 100kg
Price: negotiation
Packaging Details: wooden carton
Delivery Time: 5-15 days
Payment Terms: T/T, L/C
Supply Ability: 1000 Ton per month
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Detailed Product Description
Purity: 99.95% Pinholes: None
Anti Oxidation: 180 Degree 60 Minutes, 180 Days 23 Degree Thickness: 1/2 Oz,3/4 Oz,1 Oz,2 Oz,
Elongation: ≥ 1.5% Peel Strength: ≥ 1 N/mm
Inter Diameter: 76 Mm,152 Mm, 3 Inch,6 Inch
High Light:

edco copper foil

,

hvlp copper foil

3oz RED electrolytic High ductility copper foil
 
There are various types of copper foil are offered; in a range of weights (thicknesses). Their characteristics differ, and an understanding of these differences is important to ensure the correct selection of copper foil for each application or environmental condition.
 
Specifications:
Thickness: 3oz
Width: 1380 mm
Length: 500-5000 M
Internal diameter: 76 mm and152 mm
Purity:99.8%
 
Crystalline Structure
Electrodeposited copper crystals tend to grow lengthwise in the Z-axis of the foil. Typically, a polished section of
electrodeposited copper foil has the appearance of a picket fence, with long crystal boundaries perpendicular to
the foil plane. Rolled copper crystals are broken and crushed during the cold rolling operation. They are smaller
than the electrodeposited crystals, and have irregular, spherical shapes, nearly parallel to the foil plane.
 
Manufacturing Process:
In an electrodeposited copper manufacturing process, the copper foil is deposited on a titanium rotating drum from a copper solution where it is connected to a DC voltage source. The cathode is attached to the drum and the anode is submerged in the copper electrolyte solution. When an electric field is applied, copper is deposited on the drum as it rotates at a very slow pace. The copper surface on the drum side is smooth while the opposite side is rough. The slower the drum speed, the thicker the copper gets and vice versa. The copper is attracted and accumulated on the cathode surface of the titanium drum. The
matte and drum side of the copper foil go through different treatment cycles so that the copper could be suitable for PCB fabrication. The treatments enhance adhesion between the copper and dielectric interlayer during copper clad lamination process. Another advantage of the treatments is to act as anti-tarnish agents by slowing down oxidation of copper.
 
Application:
1. Polyimide board
2. Epoxy board
 
 
Difference between CA copper foil and ED copper foil

PropertyElectrodepositedRolled
 8um18um35um70um18um35um70um
Tensile strength,kpsi15334040202228
Elongation,%223381327

Vol resistivity
Mohm.cm

 1.661.621.621.781.741.74

 
 
FAQ:
Q1. How to save after the box opened?
 
Keep the dry environment,and is better use it in 30days.
 
Q2. Do you test all your goods before delivery?
A: Yes, we have 100% test before delivery.
 
Q3. what is your standard width?
 
A: 1380mm,we accept customization for the width. we can cut it into any size that you demand after pass discussing.
 
 
Typical properties of high ductility copper foil
 

Classification
 

UnitRequirementTest Method
Foil Designation/THM123IPC-4562A
Nominal thickness/12um1/2 OZ3/4 OZ

1
OZ

2
OZ

3
OZ

IPC-4562A
Area Weightg/㎡107±4153±5228±8285±10580±15860±20

IPC-TM-650
2.2.12.2

Purity≥99.8

IPC-TM-650
2.3.15

Foil ProfileShiny side (Ra)սm≤0.4≤0.4≤0.4≤0.4≤0.4≤0.4

IPC-TM-650
2.3.17

Matte side(Rz)um≤6≤8≤10≤10≤15≤20
Tensile Strength

R.T.(23℃)
 

Mpa≥150≥150≥235≥280≥280≥280

IPC-TM-650
2.3.18

Elongation

R.T.(23℃)
 

≥5≥5≥10≥10≥15≥15

IPC-TM-650
2.3.18

SubjectΩ.g/㎡≤0.170≤0.166≤0.162≤0.162≤0.162≤0.162

IPC-TM-650
2.5.14

Peel Strength(FR-4)N/mm≥1.0≥1.3≥1.6≥1.6≥2.1≥2.1

IPC-TM-650
2.4.8

Pinholes&porosityNumberNo

IPC-TM-650
2.1.2

Anti-oxidizationR.T.(23℃)day180/
H.T.(200℃)Minutes60/

3. Standard Width,1380(±1)mm,May according to the customer request tailor.
We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.
 

Contact Details
JIMA Copper

Contact Person: JIMA Annie

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